谁能解释一下 英文缩写和中文意思。像是着是 MHz GHz 等等!

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篇首语:本文由小常识网(cha138.com)小编为大家整理,主要介绍了谁能解释一下 英文缩写和中文意思。像是着是 MHz GHz 等等!相关的知识,希望对你有一定的参考价值。

少量列举一下就行!

参考技术A 兆赫兹……

G赫兹……

顶楼下! 厉害!
参考技术B bht 2,6-二叔丁基对甲酚 参考技术C 厉害 参考技术D 1、CPU
3DNow!(3D no waiting,无须等待的3D处理)
AAM(AMD Analyst Meeting,AMD分析家会议)
ABP(Advanced Branch Prediction,高级分支预测)
ACG(Aggressive Clock Gating,主动时钟选择)
AIS(Alternate Instruction Set,交替指令集)
ALAT(advanced load table,高级载入表)
ALU(Arithmetic Logic Unit,算术逻辑单元)
Aluminum(铝)
AGU(Address Generation Units,地址产成单元)
APC(Advanced Power Control,高级能源控制)
APIC(Advanced rogrammable Interrupt Controller,高级可编程中断控制器)
APS(Alternate Phase Shifting,交替相位跳转)
ASB(Advanced System Buffering,高级系统缓冲)
ATC(Advanced Transfer Cache,高级转移缓存)
ATD(Assembly Technology Development,装配技术发展)
BBUL(Bumpless Build-Up Layer,内建非凹凸层)
BGA(Ball Grid Array,球状网阵排列)
BHT(branch prediction table,分支预测表)
Bops(Billion Operations Per Second,10亿操作/秒)
BPU(Branch Processing Unit,分支处理单元)
BP(Brach Pediction,分支预测)
BSP(Boot Strap Processor,启动捆绑处理器)
BTAC(Branch Target Address Calculator,分支目标寻址计算器)
CBGA (Ceramic Ball Grid Array,陶瓷球状网阵排列)
CDIP (Ceramic Dual-In-Line,陶瓷双重直线)
Center Processing Unit Utilization,中央处理器占用率
CFM(cubic feet per minute,立方英尺/秒)
CMT(course-grained multithreading,过程消除多线程)
CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)
CMOV(conditional move instruction,条件移动指令)
CISC(Complex Instruction Set Computing,复杂指令集计算机)
CLK(Clock Cycle,时钟周期)
CMP(on-chip multiprocessor,片内多重处理)
CMS(Code Morphing Software,代码变形软件)
co-CPU(cooperative CPU,协处理器)
COB(Cache on board,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))
COD(Cache on Die,芯片内核集成缓存)
Copper(铜)
CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)
CPI(cycles per instruction,周期/指令)
CPLD(Complex Programmable Logic Device,复杂可程式化逻辑元件)
CPU(Center Processing Unit,中央处理器)
CRT(Cooperative Redundant Threads,协同多余线程)
CSP(Chip Scale Package,芯片比例封装)
CXT(Chooper eXTend,增强形K6-2内核,即K6-3)
Data Forwarding(数据前送)
dB(decibel,分贝)
DCLK(Dot Clock,点时钟)
DCT(DRAM Controller,DRAM控制器)
DDT(Dynamic Deferred Transaction,动态延期处理)
Decode(指令解码)
DIB(Dual Independent Bus,双重独立总线)
DMT(Dynamic Multithreading Architecture,动态多线程结构)
DP(Dual Processor,双处理器)
DSM(Dedicated Stack Manager,专门堆栈管理)
DSMT(Dynamic Simultaneous Multithreading,动态同步多线程)
DST(Depleted Substrate Transistor,衰竭型底层晶体管)
DTV(Dual Threshold Voltage,双重极限电压)
DUV(Deep Ultra-Violet,纵深紫外光)
EBGA(Enhanced Ball Grid Array,增强形球状网阵排列)
EBL(electron beam lithography,电子束平版印刷)
EC(Embedded Controller,嵌入式控制器)
EDEC(Early Decode,早期解码)
Embedded Chips(嵌入式)
EPA(edge pin array,边缘针脚阵列)
EPF(Embedded Processor Forum,嵌入式处理器论坛)
EPL(electron projection lithography,电子发射平版印刷)
EPM(Enhanced Power Management,增强形能源管理)
EPIC(explicitly parallel instruction code,并行指令代码)
EUV(Extreme Ultra Violet,紫外光)
EUV(extreme ultraviolet lithography,极端紫外平版印刷)
FADD(Floationg Point Addition,浮点加)
FBGA(Fine-Pitch Ball Grid Array,精细倾斜球状网阵排列)
FBGA(flipchip BGA,轻型芯片BGA)
FC-BGA(Flip-Chip Ball Grid Array,反转芯片球形栅格阵列)
FC-LGA(Flip-Chip Land Grid Array,反转接点栅格阵列)
FC-PGA(Flip-Chip Pin Grid Array,反转芯片针脚栅格阵列)
FDIV(Floationg Point Divide,浮点除)
FEMMS:Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态
FFT(fast Fourier transform,快速热欧姆转换)
FGM(Fine-Grained Multithreading,高级多线程)
FID(FID:Frequency identify,频率鉴别号码)
FIFO(First Input First Output,先入先出队列)
FISC(Fast Instruction Set Computer,快速指令集计算机)
flip-chip(芯片反转)
FLOPs(Floating Point Operations Per Second,浮点操作/秒)
FMT(fine-grained multithreading,纯消除多线程)
FMUL(Floationg Point Multiplication,浮点乘)
FPRs(floating-point registers,浮点寄存器)
FPU(Float Point Unit,浮点运算单元)
FSUB(Floationg Point Subtraction,浮点减)
GFD(Gold finger Device,金手指超频设备)
GHC(Global History Counter,通用历史计数器)
GTL(Gunning Transceiver Logic,射电收发逻辑电路)
GVPP(Generic Visual Perception Processor,常规视觉处理器)
HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状网阵封装
HTT(Hyper-Threading Technology,超级线程技术)
Hz(hertz,赫兹,频率单位)
IA(Intel Architecture,英特尔架构)
IAA(Intel Application Accelerator,英特尔应用程序加速器)
ICU(Instruction Control Unit,指令控制单元)
ID(identify,鉴别号码)
IDF(Intel Developer Forum,英特尔开发者论坛)
IEU(Integer Execution Units,整数执行单元)
IHS(Integrated Heat Spreader,完整热量扩展)
ILP(Instruction Level Parallelism,指令级平行运算)
IMM: Intel Mobile Module, 英特尔移动模块
Instructions Cache,指令缓存
Instruction Coloring(指令分类)
IOPs(Integer Operations Per Second,整数操作/秒)
IPC(Instructions Per Clock Cycle,指令/时钟周期)
ISA(instruction set architecture,指令集架构)
ISD(inbuilt speed-throttling device,内藏速度控制设备)
ITC(Instruction Trace Cache,指令追踪缓存)
ITRS(International Technology Roadmap for Semiconductors,国际半导体技术发展蓝图)
KNI(Katmai New Instructions,Katmai新指令集,即SSE)
Latency(潜伏期)
LDT(Lightning Data Transport,闪电数据传输总线)
LFU(Legacy Function Unit,传统功能单元)
LGA(land grid array,接点栅格阵列)
LN2(Liquid Nitrogen,液氮)
Local Interconnect(局域互连)
MAC(multiply-accumulate,累积乘法)
mBGA (Micro Ball Grid Array,微型球状网阵排列)
nm(namometer,十亿分之一米/毫微米)
MCA(machine check architecture,机器检查体系)
MCU(Micro-Controller Unit,微控制器单元)
MCT(Memory Controller,内存控制器)
MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)
MF(MicroOps Fusion,微指令合并)
mm(micron metric,微米)
MMX(MultiMedia Extensions,多媒体扩展指令集)
MMU(Multimedia Unit,多媒体单元)
MMU(Memory Management Unit,内存管理单元)
MN(model numbers,型号数字)
MFLOPS(Million Floationg Point/Second,每秒百万个浮点操作)
MHz(megahertz,兆赫)
mil(PCB 或晶片布局的长度单位,1 mil = 千分之一英寸)
MIPS(Million Instruction Per Second,百万条指令/秒)
MOESI(Modified, Owned, Exclusive, Shared or Invalid,修改、自有、排除、共享或无效)
MOF(Micro Ops Fusion,微操作熔合)
Mops(Million Operations Per Second,百万次操作/秒)
MP(Multi-Processing,多重处理器架构)
MPF(Micro processor Forum,微处理器论坛)
MPU(Microprocessor Unit,微处理器)
MPS(MultiProcessor Specification,多重处理器规范)
MSRs(Model-Specific Registers,特别模块寄存器)
MSV(Multiprocessor Specification Version,多处理器规范版本)
NAOC(no-account OverClock,无效超频)
NI(Non-Intel,非英特尔)
NOP(no operation,非操作指令)
NRE(Non-Recurring Engineering charge,非重复性工程费用)
OBGA(Organic Ball Grid Arral,有机球状网阵排列)
OCPL(Off Center Parting Line,远离中心部分线队列)
OLGA(Organic Land Grid Array,有机平面网阵包装)
OoO(Out of Order,乱序执行)
OPC(Optical Proximity Correction,光学临近修正)
OPGA(Organic Pin Grid Array,有机塑料针型栅格阵列)
OPN(Ordering Part Number,分类零件号码)
PAT(Performance Acceleration Technology,性能加速技术)
PBGA(Plastic Pin Ball Grid Array,塑胶球状网阵排列)
PDIP (Plastic Dual-In-Line,塑料双重直线)
PDP(Parallel Data Processing,并行数据处理)
PGA(Pin-Grid Array,引脚网格阵列),耗电大
PLCC (Plastic Leaded Chip Carriers,塑料行间芯片运载)
Post-RISC(加速RISC,或后RISC)
PR(Performance Rate,性能比率)
PIB(Processor In a Box,盒装处理器)
PM(Pseudo-Multithreading,假多线程)
PPGA(Plastic Pin Grid Array,塑胶针状网阵封装)
PQFP(Plastic Quad Flat Package,塑料方块平面封装)
PSN(Processor Serial numbers,处理器序列号)
QFP(Quad Flat Package,方块平面封装)
QSPS(Quick Start Power State,快速启动能源状态)
RAS(Return Address Stack,返回地址堆栈)
RAW(Read after Write,写后读)
REE(Rapid Execution Engine,快速执行引擎)
Register Contention(抢占寄存器)
Register Pressure(寄存器不足)
Register Renaming(寄存器重命名)
Remark(芯片频率重标识)
Resource contention(资源冲突)
Retirement(指令引退)
RISC(Reduced Instruction Set Computing,精简指令集计算机)
ROB(Re-Order Buffer,重排序缓冲区)
RSE(register stack engine,寄存器堆栈引擎)
RTL(Register Transfer Level,暂存器转换层。硬体描述语言的一种描述层次)
SC242(242-contact slot connector,242脚金手指插槽连接器)
SE(Special Embedded,特别嵌入式)
SEC(Single Edge Connector,单边连接器)
SECC(Single Edge Contact Cartridge,单边接触卡盒)
SEPP(Single Edge Processor Package,单边处理器封装)
Shallow-trench isolation(浅槽隔离)
SIMD(Single Instruction Multiple Data,单指令多数据流)
SiO2F(Fluorided Silicon Oxide,二氧氟化硅)
SMI(System Management Interrupt,系统管理中断)
SMM(System Management Mode,系统管理模式)
SMP(Symmetric Multi-Processing,对称式多重处理架构)
SMT(Simultaneous multithreading,同步多线程)
SOI(Silicon-on-insulator,绝缘体硅片)
SOIC (Plastic Small Outline,塑料小型)
SONC(System on a chip,系统集成芯片)
SPGA(Staggered Pin Grid Array、交错式针状网阵封装)
SPEC(System Performance Evaluation Corporation,系统性能评估测试)
SQRT(Square Root Calculations,平方根计算)
SRQ(System Request Queue,系统请求队列)
SSE(Streaming SIMD Extensions,单一指令多数据流扩展)
SFF(Small Form Factor,更小外形格局)
SS(Special Sizing,特殊缩放)
SSP(Slipstream processing,滑流处理)
SST(Special Sizing Techniques,特殊筛分技术)
SSOP (Shrink Plastic Small Outline,缩短塑料小型)
STC(Space Time Computing,空余时间计算)
Superscalar(超标量体系结构)
TAP(Test Access Port,测试存取端口)
TBGA(Tie Ball Grid Array,带状球形光栅阵列)
TCP: Tape Carrier Package(薄膜封装),发热小
TDP(Thermal Design Power,热量设计功率)
Throughput(吞吐量)
TLB(Translate Look side Buffers,转换旁视缓冲器)
TLP(Thread-Level Parallelism,线程级并行)
TMP(Threaded Multi-Path,线程多通道)
TPI(True Performance Initiative/index,真实性能为先/指标)
TQFP (Thin Plastic Quad Flat Pack,薄型方面平面封装)
Trc(Row Cycle Time,列循环时间)
TrD(Transistor Density,晶体管密度)
TSOP(Thin Small Outline Plastic,薄型小型塑料)
USWC(Uncacheabled Speculative Write Combination,无缓冲随机联合写操作)
VALU(Vector Arithmetic Logic Unit,向量算术逻辑单元)
VFSD(Vertex Frequency Stream Divider,顶点频率流分隔)
VID(VID:Voltage identify,电压鉴别号码)
VLIW(Very Long Instruction Word,超长指令字)
VPU(Vector Permutate Unit,向量排列单元)
VPU(vector processing units,向量处理单元,即处理MMX、SSE等SIMD指令的地方)
VSA(Virtual System Architecture,虚拟系统架构)
VTF(VIA Technical Forum,威盛技术论坛)
XBar(Crossbar,交叉口闩仲载逻辑单元)
XP(Experience,体验)
XP(Extra performance,额外性能)
XP(eXtreme Performance,极速性能)
散热器
TFT(Tiny Fin Technology,微型鳍片技术)
2、主板
3GIO(Third Generation Input/Output,第三代输入输出技术)
ACR(Advanced Communications Riser,高级通讯升级卡)
ADIMM(advanced Dual In-line Memory Modules,高级双重内嵌式内存模块)
AGTL+(Assisted Gunning Transceiver Logic,援助发射接收逻辑电路)
AHCI(Advanced Host Controller Interface,高级主机控制器接口)
AIMM(AGP Inline Memory Module,AGP板上内存升级模块)
AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)
AHA(Accelerated Hub Architecture,加速中心架构)
AOI(Automatic Optical Inspection,自动光学检验)
APU(Audio Processing Unit,音频处理单元)
ARF(Asynchronous Receive FIFO,异步接收先入先出)
ASF(Alert Standards Forum,警告标准讨论)
ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)
AT(Advanced Technology,先进技术)
ATX(AT Extend,扩展型AT)
Bios(Basic Input/Output System,基本输入/输出系统)
CNR(Communication and Networking Riser,通讯和网络升级卡)
CSA(Communication Streaming Architecture,通讯流架构)
CSE(Configuration Space Enable,可分配空间)
COAST(Cache-on-a-stick,条状缓存)
DASP(Dynamic Adaptive Speculative Pre-Processor,动态适应预测预处理器)
DB: Device Bay,设备插架
DMI(Desktop Management Interface,桌面管理接口)
DOT(Dynamic Overclocking Technonlogy,动态超频技术)
DPP(direct print Protocol,直接打印协议
DRCG(Direct Rambus clock generator,直接RAMBUS时钟发生器)
DVMT(Dynamic Video Memory Technology,动态视频内存技术)
E(Economy,经济,或Entry-level,入门级)
EB(Expansion Bus,扩展总线)
EFI(Extensible Firmware Interface,扩展固件接口)
EHCI(Enhanced Host Controller Interface,加强型主机端控制接口)
EISA(Enhanced Industry Standard Architecture,增强形工业标准架构)
EMI(Electromagnetic Interference,电磁干扰)
ESCD(Extended System Configuration Data,可扩展系统配置数据)
ESR(Equivalent Series Resistance,等价系列电阻)
FBC(Frame Buffer Cache,帧缓冲缓存)
FireWire(火线,即IEEE1394标准)
FlexATX(Flexibility ATX,可扩展性ATX)
FSB(Front Side Bus,前端总线)
FWH(Firmware Hub,固件中心)
GB(Garibaldi架构,Garibaldi基于ATX架构,但是也能够使用WTX构架的机箱)
GMCH(Graphics & Memory Controller Hub,图形和内存控制中心)
GPA(Graphics Performance Accelerator,图形性能加速卡)
GPIs(General Purpose Inputs,普通操作输入)
GTL+(Gunning Transceiver Logic,发射接收逻辑电路)
HDIT(High Bandwidth Differential Interconnect Technology,高带宽微分互连技术)
HSLB(High Speed Link Bus,高速链路总线)
HT(HyperTransport,超级传输)
I2C(Inter-IC)
I2C(Inter-Integrated Circuit,内置集成电路)
IA(Instantly Available,即时可用)
IBASES(Intel Baseline AGP System Evaluation Suite,英特尔基线AGP系统评估套件)
IC(integrate circuit,集成电路)
ICH(Input/Output Controller Hub,输入/输出控制中心)
ICH-S(ICH-Hance Rapids,ICH高速型)
ICP(Integrated Communications Processor,整合型通讯处理器)
IHA(Intel Hub Architecture,英特尔Hub架构)
IMB(Inter Module Bus,隐藏模块总线)
INTIN(Interrupt Inputs,中断输入)
IPMAT(Intel Power Management Analysis Tool,英特尔能源管理分析工具)
IR(infrared ray,红外线)
IrDA(infrared ray,红外线通信接口,可进行局域网存取和文件共享)
ISA(Industry Standard Architecture,工业标准架构)
ISA(instruction set architecture,工业设置架构)
K8HTB(K8 HyperTransport Bridge,K8闪电传输桥)
LSI(Large Scale Integration,大规模集成电路)
LPC(Low Pin Count,少针脚型接口)
MAC(Media Access Controller,媒体存储控制器)
MBA(manage boot agent,管理启动代理)
MC(Memory Controller,内存控制器)
MCA(Micro Channel Architecture,微通道架构)
MCH(Memory Controller Hub,内存控制中心)
MDC(Mobile Daughter Card,移动式子卡)
MII(Media Independent Interface,媒体独立接口)
MIO(Media I/O,媒体输入/输出单元)
MOSFET(metallic oxide semiconductor field effecttransistor,金属氧化物半导体场效应晶体管)
MRH-R(Memory Repeater Hub,内存数据处理中心)
MRH-S(SDRAM Repeater Hub,SDRAM数据处理中心)
MRIMM(Media-RIMM,媒体RIMM扩展槽)
MSI(Message Signaled Interrupt,信息信号中断)
MSPCE(Multiple Streams with Pipelining and Concurrent Execution,多重数据流的流水线式传输与并发执行)
MT=MegaTransfers(兆传输率)
MTH(Memory Transfer Hub,内存转换中心)
MuTIOL(Multi-Threaded I/O link,多线程I/O链路)
NCQ(Native Command Qu,本地命令序列)
NGIO(Next Generation Input/Output,新一代输入/输出标准)
NPPA(nForce Platform Processor Architecture,nForce平台处理架构)
OHCI(Open Host Controller Interface,开放式主控制器接口)
ORB(operation request block,操作请求块)
ORS(Over Reflow Soldering,再流回焊接,SMT元件的焊接方式)
P64H(64-bit PCI Controller Hub,64位PCI控制中心)
PCB(printed circuit board,印刷电路板)
PCBA(Printed Circuit Board Assembly,印刷电路板装配)
PCI(Peripheral Component Interconnect,互连外围设备)
PCI SIG(Peripheral Component Interconnect Special Interest Group,互连外围设备专业组)
PDD(Performance Driven Design,性能驱动设计)
PHY(Port Physical Layer,端口物理层)
POST(Power On Self Test,加电自测试)
PS/2(Personal System 2,第二代个人系统)
PTH(Plated-Through-Hole technology,镀通孔技术)
RE(Read Enable,可读取)
QP(Quad-Pumped,四倍泵)
RBB(Rapid BIOS Boot,快速BIOS启动)
RNG(Random number Generator,随机数字发生器)
RTC(Real Time Clock,实时时钟)
KBC(KeyBroad Control,键盘控制器)
SAP(Sideband Address Port,边带寻址端口)
SBA(Side Band Addressing,边带寻址)
SBC(single board computer,单板计算机)
SBP-2(serial bus protocol 2,第二代串行总线协协)
SCI(Serial Communications Interface,串行通讯接口)
SCK (CMOS clock,CMOS时钟)
SDU(segment data unit,分段数据单元)
SFF(Small Form Factor,小尺寸架构)
SFS(Stepless Frequency Selection,步进频率选项)
SMA(Share Memory Architecture,共享内存结构)
SMT(Surface Mounted Technology,表面黏贴式封装)
SPI(Serial Peripheral Interface,串行外围设备接口)
SSLL(Single Stream with Low Latency,低延迟的单独数据流传输)
STD(Suspend To Disk,磁盘唤醒)
STR(Suspend To RAM,内存唤醒)
SVR(Switching Voltage Regulator,交换式电压调节)
THT(Through Hole Technology,插入式封装技术)
UCHI(Universal Host Controller Interface,通用宿主控制器接口)
UPA(Universal Platform Architecture,统一平台架构)
UPDG(Universal Platform Design Guide,统一平台设计导刊)
USART(Universal Synchronous Asynchronous Receiver Transmitter,通用同步非同步接收传送器)
USB(Universal Serial Bus,通用串行总线)
USDM(Unified System Diagnostic Manager,统一系统监测管理器)
VID(Voltage Identification Definition,电压识别认证)
VLB(Video Electronics Standards Association Local Bus,视频电子标准协会局域总线)
VLSI(Very Large Scale Integration,超大规模集成电路)
VMAP(VIA Modular Architecture Platforms,VIA模块架构平台)
VSB(V Standby,待命电压)
VXB(Virtual Extended Bus,虚拟扩展总线)
VRM(Voltage Regulator Module,电压调整模块)
WCT(Wireless Connect Technology,无线连接技术)
WE(Write Enalbe,可写入)
WS(Wave Soldering,波峰焊接,THT元件的焊接方式)
XT(Extended Technology,扩充技术)
ZIF(Zero Insertion Force, 零插力插座)
芯片组
ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)
AGP(Accelerated Graphics Port,图形加速接口)
BMS(Blue Magic Slot,蓝色魔法槽)
I/O(Input/Output,输入/输出)
MIOC: Memory and I/O Bridge Controller,内存和I/O桥控制器
NBC: North Bridge Chip(北桥芯片)
PIIX: PCI ISA/IDE Accelerator(加速器)
PSE36: Page Size Extension 36-bit,36位页面尺寸扩展模式
PXB: PCI Expander Bridge,PCI增强桥
RCG: RAS/CAS Generator,RAS/CAS发生器
SBC: South Bridge Chip(南桥芯片)
SMB(System Management Bus,全系统管理总线)
SPD(Serial Presence Detect,连续存在检测装置)
SSB: Super South Bridge,超级南桥芯片
TDP: Triton Data Path(数据路径)
TSC: Triton System Controller(系统控制器)
QPA: Quad Port Acceleration(四接口加速)

主板技术
Gigabyte
ACOPS: Automatic CPU OverHeat Prevention System(CPU过热预防系统)
SIV: System Information Viewer(系统信息观察)
磐英
ESDJ(Easy Setting Dual Jumper,简化CPU双重跳线法)
浩鑫
UPT(USB、PANEL、LINK、TV-OUT四重接口)
华硕
C.O.P(CPU overheating protection,处理器过热保护)

3、显示设备
AD(Analog to Digitalg,模拟到数字转换)
ADC(Apple Display Connector,苹果专用显示器接口)
AGC(Anti Glare Coatings,防眩光涂层)
AMR(ATi Multi-Rendering technology,ATi多重渲染技术)
ASIC(Application Specific Integrated Circuit,特殊应用积体电路)
ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)
ASC(Anti Static Coatings,防静电涂层)
ASD(Auto Stereoscopic Display,自动立体显示)
AG(Aperture Grills,栅条式金属板)
ARC(Anti Reflect Coating,防反射涂层)
BLA: Bearn Landing Area(电子束落区)
BMC(Black Matrix Screen,超黑矩阵屏幕)
CCS(Cross Capacitance Sensing,交叉电容感应)
cd/m^2(candela/平方米,亮度的单位)
CDRS(Curved Directional Reflection Screen,曲线方向反射屏幕)
CG-Silicon(Continuous Grain Silicon,连续微粒硅)
CNT(carbon nano-tube,碳微管)
CRC(Cyclical Redundancy Check,循环冗余检查本回答被提问者采纳

CMP是什么意思?谁能解释下?

现在英文缩写词汇急剧增多,很多缩写包含多种完全不同的意思,CMP也不例外。那具体CMP是什么意思?包含哪些意思?谁能解释下?

CMP是什么意思?谁能解释下?

1、管理平台

营销活动管理平台,CMP其实是基于数据仓库数据基础之上,利用NCR的一个TCRM产品做的一个分析应用。

2、cmp指令

CMP指令是由美国斯坦福大学提出的,英文名称是Chip multiprocessors,翻译成中文就是单芯片多处理器;也指多核心其思想是将大规模并行处理器中的SMP(对称多处理器)集成到同一芯片内,各个处理器并行执行不同的进程。

3、cmp函数

一个函数,可以向其传入两个任意类型变量的地址或指针,但不管传入什么类型,函数内部将该指针转换为int类型,也就是说将s所指向的地址上4个字节的数据转换为int型数,t同理,然后将这两个数相减,作为结果返回。

4、云管平台

Cloud Management Platform,是一种管理公有云、私有云和混合云的产品,为企业提供管理跨多个云基础设施的服务。

5、计算机

Chip multiprocessors,单芯片多处理器,也指多核心。

以上只是一小部分CMP缩写的意思哦,还有更多等待大家去挖掘哦!

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